News:New Package Submission Deadline March 31
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shepherl 3.8k
@lshep
Last seen 39 minutes ago
United States

The new package submission deadline is March 31. This deadline will serve as the potential to be included in release 3.5 pending review; packages after this deadline will remain in Bioconductor devel pending proper review.

 

bioconductor issue tracker News • 860 views
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